e-Shuttle, Inc. is now delivering 65nm CMOS logic ICs manufactured using Electron-Beam Direct Write technology, the first full-scale application of EBDW techniques for complex logic ICs. e-Shuttle is now working with design house partners, including leading mask manufacturers Dai-Nippon Printing, Toppan Printing, and Hoya, to support customers that require IC prototyping.

    e-Shuttle also is successfully applying EBDW technology for devices using 90nm process technology, manufacturing structured ASICs for a fabless semiconductor company in the U.S. Producing single-layer via interconnect patterns using EBDW provides a short delivery cycle with mask-less production. EB lithography has proven capable of producing yields comparable to optical lithography. e-Shuttle will expand its capacity for electron beam products with the rollout of a second EB lithography station set for middle of next month.

    The initial lithography station, for full-scale production using 300mm wafers, went into service in November 2007. Implementation of the second station will increase production capacity and help e-Shuttle develop the technology for the next generation of ICs. The 300mm wafer shuttle service - in which wafer delivery combines the orders of multiple customers - dramatically reduces costs. The EBDW technology has achieved excellent results without compromising yield, demonstrating that EB lithography and ArF lithography can coexist in the fabrication process.

    "The alliances between mask-less proponent e-Shuttle and mask makers are symbolic of the direction the industry is taking," stated Dr. Haruo Tsuchikawa, president of e-Shuttle. "These partnerships in Japan represent the company's first round of alliances; e-Shuttle will also pursue partnerships with international prototyping companies. We are now negotiating with prototyping companies in the U.S., Europe and China." He added that e-Shuttle is now working on EBDW for 40-nanometer process technology and expects to offer this capability by the end of fiscal 2008.  

    EBDW technique is not exclusive to SiExpress. Customers who develop Fujitsu Microelectronics's ASIC and COT products can also take the benefit of prototyping with EB lithography. Although customers will not be able to share the reticle cost with other customers who uses the conventional reticle-based shuttle services, however, they will enjoy an advantage of mask-less lithography technique for reasonable cost and low risk development. Fujitsu Microelectronics sales and marketing division will support customers to utilize EBDW for their products.