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Renesas Technology Introduces The CEVA Bluetooth IP IC  » read source
    CEVA, Inc., announced that Renesas Technology Corp. has commenced high-volume shipments of their chipsets with integrated Bluetooth connectivity powered by CEVA-Bluetooth IP. Renesas has successfully secured a number of key customers for their leading-edge solution, which will see their chip deployed in automotive applications for some of the world's leading car manufacturers.

    Paddy McWilliams, Managing Director, Communications Product Line at CEVA stated:
"CEVA and Renesas have enjoyed a strong relationship in the development of Renesas' product offerings incorporating our CEVA-Bluetooth IP and we are very pleased to see their leading-edge technology deployed in high volumes. We look forward to continuing our successful partnership with them and the continued development of new and innovative Bluetooth products."

    "Throughout the development process of our chip, CEVA provided excellent technical support in addition to their comprehensive Bluetooth IP
and we are pleased to complete Bluetooth IP in cooperation with CEVA," said Masayuki Hirokawa, senior manager of Automotive Application Engineering Dept.2, Automotive Semiconductor Business Unit at Renesas Technology Corp. "We acknowledge the success that the CEVA-Bluetooth IP has had in the successful development and deployment of our Bluetooth chipsets and envisage further success for our partnership."

    CEVA offers a range of Bluetooth hardware and software IP ranging from Bluetooth 1.2
through to Bluetooth 2.0+EDR. CEVA's latest Bluetooth 2.0+EDR IP consists of an RTL baseband engine coupled with an ANSI C software stack. It is available as a discrete IP package for use with 3rd party embedded processors or it may be licensed together with a CEVA DSP for a complete Bluetooth platform.

    Bluetooth baseband RTL provides the radio interface and lower link-controller hardware in RTL.
It complies fully with Bluetooth specification 1.2, Such a platform can be also coupled with a complete set of audio codecs, voice codecs, echo cancellation and noise suppression algorithms, yielding an integrated Bluetooth and multimedia solution. The RTL incorporates many features that reduce system cost and power consumption, including support for a single clock source, software-controlled low-power modes, and small memory size.

    The Bluetooth protocol stack is written in ANSI C using object-oriented techniques.
It is designed for portability across processors and RTOSs and modularity, allowing optimal object-code generation. In a minimum configuration, the Bluetooth HCI protocol stack requires less than 90kbytes of code space.

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